CMS300 (in-plane)

A tiny, low-cost, precise Combi-Sensor delivering class-leading bias and noise over temperature.

Our CMS MEMS combi-sensor combines a single-axis gyro and dual-axis low-g accelerometer. The unit features user-selectable dynamic range and bandwidth, with a digital SPI output. The CMS300 mounts flat on a board, combined enables all axes to be measured using a single board (PCBA). Measurement range and bandwidth of all three channels can be independently selected by the user. Dynamic range and bandwidth of all three channels can be independently selected by the user for optimal sensitivity.

Production Status: In Production
Please contact us directly at sales@siliconsensing.com
Availability: Available
Customer Applications: New and existing applications

Supply Voltage3.3V
Angular Random Walk0.40º/√hr
Bias Instability10°/hr
Bandwidth (nominal)45, 55, 90 or 110Hz Acc; 45, 62, 95 or 190Hz (user selectable)
Operating Temperature-40°C to +125°C
Typ. Current Consumption8mA
Angular Rate Range±150°/s to ±300°/s
Axes of Acceleration2
Acceleration Range±2.5 to ±10g
Velocity Random Walk<0.05 m/s/√hr
Rate SF over Temp±2.0%
Rate Bias Over Temperature±1.0˚/s typ ±1.75˚/s max
Acc Bias over Temp±30mg to ±75mg
Acc SF over Temp±2.5%
Baud RateSPI msg rate max 10kHz clock rate 7MHz
Accelerometer Bias Instability<0.05mg
Vibration Rectification Error0.001°/s/g2 rms to 0.003°/s/g2 rms
Do I need to do anything special to minimize the misalignment of CMS combi-sensors when mounting them on a PCB?

The user of our combi-sensors will be interested in the misalignments of the accelerometers and the gyroscope to theoretical datums on the PCB.
The datasheet for the CMS300 quotes a potential misalignment of 1.5% to the package. Mounting of the CMS300 is straightforward, and no particular allowance needs to be made for mounting inaccuracy.

Mounting the CMS390 is more difficult. The package is very tall for its width, and the mounting face is not completely flat. The datasheet includes an additional allowance for the lack of flatness of this mounting face, and with reasonable care in placement, the datasheet limit of 3% should be achieved. If additional accuracy is required, the use of special fixtures or jigs could improve the perpendicularity of the package and hence minimize the misalignment of the sensor to the PCB.
If there is a processing capability present with the system, any residual misalignments errors can be corrected within the processor.

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